In the high-end manufacturing fields such as semiconductors, automotive electronics, and 5G communication, "welding reliability" directly determines the product lifespan and safety. Traditional reflow soldering is prone to problems like oxidation, voids, and incomplete welding during high-temperature soldering, especially when dealing with precision components such as Chiplet heterogeneous integration and SiC power modules, where the defect rate remains high. However, vacuum reflow soldering, through the dual technological breakthrough of "vacuum environment + precise temperature control", has become the core solution to address the pain points of high-end welding - the void rate of solder joints can be controlled at ≤2% (for some high-end equipment, it can reach below 1%), and the shear strength is increased by 30%-50%, perfectly meeting the demand for the upgrade of electronic manufacturing to "smaller size, higher density, and higher reliability".